| 发明名称 |
POLISHING PAD FOR ENDPOINT DETECTION AND RELATED METHODS |
| 摘要 |
A polishing pad has a polishing layer with a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
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| 申请公布号 |
US2013295826(A1) |
申请公布日期 |
2013.11.07 |
| 申请号 |
US201313942417 |
申请日期 |
2013.07.15 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
SWEDEK BOGUSLAW A.;BIRANG MANOOCHER |
| 分类号 |
B24B37/20;B24B49/10;B24B37/00;B24B37/04;B24B49/00;B24B49/02;B24B49/12;B24D7/12;B24D11/00;B24D11/02;B24D13/14;H01L21/304 |
主分类号 |
B24B37/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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