| 摘要 |
<p>Provided is a copper foil with surface treatment layers, which is characterized by comprising a copper foil or copper alloy foil and, formed thereon, a plurality of surface treatment layers that comprise a roughened layer formed through a roughening treatment, a heat-resistant layer constituted of a Ni-Co layer formed on the roughened layer, and a weatherable layer and a rust-preventive layer which contain Zn, Ni, or Cr and have been formed on the heat-resistant layer, the surface treatment layers having a (total Zn)/[(total Zn)+(total Ni)] ratio of 0.13-0.23. Also provided is a copper foil for printed circuits which is obtained by forming a layer on a surface of a copper foil through a roughening treatment, subsequently forming a heat-resistant layer and a rust-preventive layer thereon, and then subjecting the rust-preventive layer to a treatment with a silane coupling agent. When a fine-pattern printed circuit is formed in a copper-clad laminate formed using the copper foil for printed circuits and the substrate thereafter is subjected to an acid treatment or chemical etching, then the decrease in adhesion due to acid infiltration into the interface between the copper foil circuit and the substrate resin can be more inhibited. Thus, the copper foil for printed circuits has excellent adhesion strength with respect to acid resistance and has excellent alkali etchability.</p> |
