| 摘要 |
A spherical body polishing apparatus capable of reducing polishing costs includes a rotating disk (10) having a rotating disk polishing surface (10A) and a fixed disk having a fixed disk polishing surface opposed to the rotating disk polishing surface (10A). The rotating disk polishing surface (10A) is capable of relative rotation while keeping being opposed to the fixed disk polishing surface. The rotating disk polishing surface (10A) has a groove portion (11) formed therein and extending circumferentially along the rotation. The rotating disk (10) having the groove portion (11) therein includes an abrasive grain layer (18) having a higher hardness than that of a material ball which is a spherical body and a holding layer (19) formed on the abrasive grain layer (18) and having a lower hardness than that of the abrasive grain layer (18). The groove portion (11) is formed to penetrate the holding layer (19) in a depth direction and to reach the abrasive grain layer (18). |
