| 摘要 |
<p>The present invention provides a dicing die-bonding film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the pressure-sensitive adhesive layer. A dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the dicing film, wherein the pressure-sensitive adhesive layer contains a polymer that is obtained by the addition-reaction of an acrylic polymer containing 10 to 30 mol % of a hydroxyl group-containing monomer with 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and also contains 2 to 20 parts by weight of a crosslinking agent containing two or more functional groups having reactivity with a hydroxyl group in the molecule based on 100 parts by weight of the polymer, and the die-bonding film comprises an epoxy resin.</p> |
