| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a power module with a heat sink, which can efficiently diffuse heat generated from an electronic component or the like and has high heat cycle reliability, and to provide the power module for the heat sink. SOLUTION: The substrate for the power module with the heat sink includes: the substrate 10 for the power module where a circuit layer 12 comprising aluminum or an aluminum alloy is formed on one surface of an insulating substrate 11 and a metal layer 13 comprising the aluminum or the aluminum alloy is formed on the other surface of the insulating substrate 11; and the heat sink 30 bonded to the side of the metal layer 13. The heat sink 30 has a top plate part 31 bonded to the metal layer 13, and the top plate part 31 comprises an aluminum base composite material where the aluminum or the aluminum alloy is filled in a carbonaceous member. COPYRIGHT: (C)2010,JPO&INPIT |
