| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with a heat dissipation member which can inhibit cracks occurring in an encapsulation resin reaching a semiconductor element and a conductive member and reliably isolate the conductive member and the heat dissipation member. SOLUTION: A semiconductor device 101 with a heat dissipation member comprises a semiconductor chip 1, a die pad part 2a, a heat sink 3, a first resin block 10 and a second resin block 20 each forming gaps g1 respectively with the die pad part 2a and with the heat sink 3 and having similar structures. The first resin block 10 includes a first resin layer 11 and a third resin layer 13 consisting of first resin materials, and a second resin layer 12 consisting of a second resin material. The first resin layer 11 contacts the die pad part 2a, and the second resin layer 12 does not contact the die pad part 2a. The first resin material has a melting point lower than that of the second resin material. Furthermore, the semiconductor device 101 with a heat dissipation member is encapsulated by an encapsulation resin 4 consisting of the first resin material. COPYRIGHT: (C)2012,JPO&INPIT |
