| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition allowing both of low-temperature adhesiveness and heat resistance to be sufficiently excellent. SOLUTION: The adhesive composition comprises a modified amide-imide resin obtained by reacting an amide-imide resin having one or more carboxy groups with an epoxy resin having one or more epoxy groups; and an adhesive sheet is provided with a film adhesive and a support base, which are provided by forming the composition in a film shape, and the above film adhesive formed on the support base. COPYRIGHT: (C)2008,JPO&INPIT |
