| 摘要 |
<p>[Problem] Provided is a wiring substrate, an imaging device as well as an imaging device module that can be made compact and with which the reliability of the joint to the external circuit board can be improved. [Solution] A imaging device includes a first insulating substrate (1a) having a through hole (2), a connection electrode (4) and a first wiring conductor (3a), a second insulating substrate (1b) having outside terminals (5) and a second wiring conductor (3b), and an imaging element (6) including a light-receiving portion (6a) arranged at a center portion on an upper surface thereof and a connection terminal (6b) arranged at an outer peripheral portion thereof, at least one of the lower surface of the first insulating substrate (1a) and the upper surface of the second insulating substrate (1b) including a recess portion (7), the through hole (2) being located on an inner side thereof, the imaging element (6) being arranged below the first insulating substrate (1a) such that the light-receiving portion (6a) is located within the through hole (2), the connection terminal (6b) being electrically connected to the connection electrode (4), the imaging element being accommodated inside the recess portion (7), outer peripheral portions of the first insulating substrate (1a) and the second insulating substrate (1b) being electrically connected to each other. Since the outside terminals (5) can be formed on the lower surface of the imaging device with a larger surface area, peeling off of the outside terminals (5) from the external circuit board can be suppressed.</p> |
