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发明名称
SCRIBE-LINE THROUGH SILICON VIAS
摘要
A semiconductor wafer includes dies to be scored from the semiconductor wafer. The semiconductor wafer also includes scribe-lines between the dies. Each scribe-line includes multiple through silicon vias.
申请公布号
KR20130122020(A)
申请公布日期
2013.11.06
申请号
KR20137027064
申请日期
2010.02.05
申请人
QUALCOMM INCORPORATED
发明人
CHANDRASEKARAN ARVIND
分类号
H01L21/78;H01L21/301
主分类号
H01L21/78
代理机构
代理人
主权项
地址
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