| 摘要 |
The sensor (100) has a transducer unit (10) placed in a housing sleeve (20) at a measurement end (22). A module carrier (30) is received in the housing sleeve. Sensor electronics (34) are placed on the carrier and extend along an axis of the housing sleeve. Illuminants e.g. surface mount device LED (44), is used for optical signaling to an outside of operating and switching states of the sensor, where the illuminants are placed on a separate plate-like illuminant carrier (40). The illuminant carrier is positioned transversely to the module carrier in the vicinity of the transducer unit. An independent claim is also included for a method for manufacturing a sensor.
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