Method for detecting defects in a packaging material

摘要

A method and a device for detecting defects in a packaging laminate having at least one conductive layer are provided. The method comprises the steps of grounding the conductive layer of the packaging laminate, arranging an electrode adjacent to the packaging laminate, applying a high voltage to the electrode by ramping the voltage from an initial value towards an upper predetermined value, and detecting a defect in the packaging material by registering dielectric breakdown between the electrode and the conductive layer of the packaging laminate.