发明名称 |
WIRING SUBSTRATE, IMAGE PICKUP DEVICE, AND IMAGE-PICKUP DEVICE MODULE |
摘要 |
A image pickup device includes a wiring substrate and an image pickup device. A wiring substrate includes an insulating substrate and a plurality of connection electrodes. The insulating substrate has a penetrating hole, and has an inclined area where its lower surface is inclined downward toward the opening. The plurality of connection electrodes are disposed in a surrounding region around the penetrating hole on the lower surface of the insulating substrate, and are to be electrically connected to an image sensor. The image pickup device is mounted on the lower surface of the insulating substrate of the wiring substrate, and is electrically connected to the plurality of connection electrodes. |
申请公布号 |
KR20130120981(A) |
申请公布日期 |
2013.11.05 |
申请号 |
KR20127031487 |
申请日期 |
2011.06.28 |
申请人 |
KYOCERA CORPORATION |
发明人 |
ICHIKI SHINJI;SEGAWA HIROYUKI |
分类号 |
H04N5/225;H01L27/14;H04N5/335 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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