发明名称 |
Single-layer PCB microfluidics |
摘要 |
A printed circuit board structure is coated with an encapsulant within which microfluidic channels have been formed. The microfluidic channels are formed by soldering fluidic connections to metal traces on a surface of the printed circuit board structure prior to encapsulation. The metal traces are removed by etching after encapsulation to form microchannels within the encapsulant. |
申请公布号 |
US8574513(B2) |
申请公布日期 |
2013.11.05 |
申请号 |
US201213448810 |
申请日期 |
2012.04.17 |
申请人 |
CHEN SAMSON;RAJAGOPAL ADITYA;SCHERER AXEL;CALIFORNIA INSTITUTE OF TECHNOLOGY |
发明人 |
CHEN SAMSON;RAJAGOPAL ADITYA;SCHERER AXEL |
分类号 |
G01N15/06 |
主分类号 |
G01N15/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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