发明名称 Semiconductor device having air gap and method of fabricating the same
摘要 A semiconductor device includes tunneling insulating layers on active regions of a substrate, floating gate electrodes on the tunneling insulating layers, an isolation trench within the substrate and the isolation trench defines the active region, spaces the tunneling insulating layers, and isolates the floating gate electrodes. A bottom of the isolation trench is directly in contact with the substrate. The semiconductor device further includes a lower insulating layer on the floating gate electrodes, and a middle insulating layer, an upper insulating layer, and a control gate electrode stacked on the lower insulating layer. The lower insulating layer is configured to hermetically seal a top portion of the isolation trench to define and directly abut an air gap within the isolation trench.
申请公布号 US8575680(B2) 申请公布日期 2013.11.05
申请号 US201213564117 申请日期 2012.08.01
申请人 SHIN YOO-CHEOL;LEE JOON-HEE;SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIN YOO-CHEOL;LEE JOON-HEE
分类号 H01L29/788 主分类号 H01L29/788
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