发明名称 Semiconductor device with a balun
摘要 A semiconductor integrated circuit device with a balun which is formed above a conductive semiconductor substrate and which includes a dielectric film, an unbalanced line for transmitting an unbalanced signal, and balanced lines for transmitting a balanced signal. The unbalanced line is placed opposite to the balanced lines via a nano-composite film that is a region of the dielectric film. The nano-composite film, interposed between the unbalanced line and the balanced lines, has a relative permittivity higher than that of other regions of the dielectric film. This allows suppression of electromagnetic coupling of transmission lines or passive elements other than the balun, thereby providing a semiconductor device with a wide-band and small-size balun.
申请公布号 US8575731(B2) 申请公布日期 2013.11.05
申请号 US20090999472 申请日期 2009.06.15
申请人 UJITA SHINJI;FUKUDA TAKESHI;SAKAI HIROYUKI;PANASONIC CORPORATION 发明人 UJITA SHINJI;FUKUDA TAKESHI;SAKAI HIROYUKI
分类号 H01L23/58 主分类号 H01L23/58
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