发明名称 Backlight module with heat dissipating element and heat sink
摘要 A backlight module includes a light guide plate, a back plate, a heat-dissipating element, a light-emitting element, and at least one high-performance heat sink. The heat-dissipating element is disposed adjacent to a light incident surface of the light guide plate, and the heat-dissipating element has a bottom portion and a side portion forming an angle with the bottom portion. The light-emitting element is disposed on one side of the heat-dissipating element facing the light guide plate. The high-performance heat sink is disposed on the back plate, one end of the high-performance heat sink overlaps the heat-dissipating element, and another end of the high-performance heat sink extends away from the light-emitting element.
申请公布号 US8573811(B2) 申请公布日期 2013.11.05
申请号 US201113073057 申请日期 2011.03.28
申请人 LIN HUNG-CHIH;LIN YI-WEN;YOUNG LIGHTING TECHNOLOGY INC. 发明人 LIN HUNG-CHIH;LIN YI-WEN
分类号 F21V29/00 主分类号 F21V29/00
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