| 摘要 |
A method of manufacturing a thin film device according to an aspect of the invention may include: preparing a substrate on which a sacrificial layer and a thin film to be transferred are sequentially formed; temporarily bonding the thin film to a circumferential surface of the transfer roll, and simultaneously removing the sacrificial layer to separate the thin film from the substrate at a first position of a transfer roll that is rolling; and transferring the thin film onto a sheet by running the sheet so that a surface of the sheet is bonded to the thin film temporarily bonded to the circumferential surface of the transfer roll. The substrate may be a transparent substrate.
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