发明名称 |
Semiconductor element mounting member, method of producing the same, and semiconductor device |
摘要 |
A semiconductor element mounting member is arranged to infiltrate a matrix metal into a porous body that is formed by sintering diamond particles being in direct contact with each other and that has an infiltration auxiliary layer selectively formed only on the exposed surface of each diamond particle. A production method includes a step at which a mixture of diamond particles, a powder of a chemical element out of which the infiltration auxiliary layer is made, and an ammonium chloride powder is compressed and molded, is then heated to 900° C. or more, and is formed into the porous body. A semiconductor device has a semiconductor element mounted on an element mounting surface of the semiconductor element mounting member with a connecting layer therebetween.
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申请公布号 |
US8575625(B2) |
申请公布日期 |
2013.11.05 |
申请号 |
US201213564426 |
申请日期 |
2012.08.01 |
申请人 |
TAKASHIMA KOUICHI;AOI YOSHIFUMI;KAMIJO EIJI;A.L.M.T. CORP. |
发明人 |
TAKASHIMA KOUICHI;AOI YOSHIFUMI;KAMIJO EIJI |
分类号 |
H01L29/15 |
主分类号 |
H01L29/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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