发明名称 |
Semiconductor chip device with liquid thermal interface material |
摘要 |
A method of manufacturing is provided that includes providing a semiconductor chip device that has a circuit board and a first semiconductor chip coupled thereto. A lid is placed on the circuit board. The lid includes an opening and an internal cavity. A liquid thermal interface material is placed in the internal cavity for thermal contact with the first semiconductor chip and the circuit board.
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申请公布号 |
US8574965(B2) |
申请公布日期 |
2013.11.05 |
申请号 |
US20100910379 |
申请日期 |
2010.10.22 |
申请人 |
REFAI-AHMED GAMAL;SU MICHAEL Z.;BLACK BRYAN;ATI TECHNOLOGIES ULC;ADVANCED MICRO DEVICES, INC. |
发明人 |
REFAI-AHMED GAMAL;SU MICHAEL Z.;BLACK BRYAN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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