THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

摘要

The present invention provides a printed circuit board manufacturing method comprising the following steps of: stacking two first metal layers; forming two core insulating layers having internal circuit patterns in an upper surface or a lower surface and including an electronic element therein; forming a first stacked structure by disposing the two first metal layers between the two core insulating layers and disposing upper insulating layers between the first metal layers and the core insulating layers; disposing lower insulating layers in an upper part and a lower part of the first stacked structure and disposing each of the second metal layers in the lower insulating layer; forming a second stacked structure consisting of the first stacked structure, the lower insulating layer, and the second metal layers; forming two base circuit boards by separating the two first metal layers from the second stacked structure; and forming an external circuit pattern from the first and second metal layers of the two base circuit boards. The printed circuit board manufacturing method secures a proper thickness of boards by processing two boards at the same time and prevents the boards from being twisted by volume reduction when hardening insulating layers, thereby improving the reliability of a printed circuit board.