发明名称 Thermal conductive epoxy molding compound and manufacturing method of heatsink using the same
摘要 PURPOSE: A heat dissipation swelling filling material is provided to widen a unit area by molding with a molding liquid which removes an attachment mode and a process mode of an aluminum plate, thereby improving heat dissipation performance. CONSTITUTION: An aluminum can(1) is arranged in an overturned state. The aluminum can is filled with heat dissipation filler(5). An object is arranged on a prepared jig or a work plate. The object is inserted into a preheated oven. The object is hardened for approximately one hour at a temperature of 175°C. The hardening time differs by the size, shape, and thickness of the object. The hardened object is processed according to purposes of the object. A half-assembled LED printed circuit board(2), a transparent lens(3), and a wire(4) are processed by arranging a hole. An encapsulation material(6) is injected into the object. The injected encapsulation material is hardened for approximately one hour at a temperature of 50°C.
申请公布号 KR101321884(B1) 申请公布日期 2013.11.04
申请号 KR20120052347 申请日期 2012.05.17
申请人 发明人
分类号 F21V29/00;H05K7/20 主分类号 F21V29/00
代理机构 代理人
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