| 摘要 |
The present invention provides a heat curable resin composition with excellent physical properties for a protection film, such a heat resistance, heat-radiating property, alkali resistance, and adhesion, a protection film for a display device, and a forming method of a protective film for a display device. The heat-curable resin composition for forming a protective film comprises a polymer formed by polymerizing monomers including an unsaturated compound and a compound represented by chemical formula 1. The content of the compound is 50-300 parts by weight based on 100 parts by weight of the polymer. |
