| 摘要 |
The present invention relates to a method for manufacturing an LED module to improve the heat dissipation of the LED module by adjacently installing a plurality of conductive electrode plates which are electrically separated on the same plane, laminating insulation layers on the upper and lower sides of the electrode plate, and grounding both poles of the LED chip on the separated electrode plate by forming a plurality of ground holes on one side of the insulation layer to expose the electrode plate. |
