| 摘要 |
A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. The braid is formed having a single ply and is configured for desoldering the printed circuit board or electrical component having a lead-free solder having a melting point temperature in excess of 183° C. (about 361° F.). |
