ADHESIVE COMPOSITION AND ADHESIVE SHEET, MATERIAL FOR PROTECTING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

The purpose of the present invention is to provide an adhesive composition which is preferably used for the manufacture of a semiconductor device and, especially, to the adhesive composition which prevents a void from being easily generated between bumps in a bonding process and protects the positional deviation of the bump and the generation of a void after solder junction. To this end, the adhesive composition contains polymers with a reactive functional group, thermosetting resins and compounds with flux action and has the lowest melting point of less than 500 Pa·s at the temperature of less than 200 and the melting point of more than 500 Pa·s at the temperature of 200.