| 摘要 |
Disclosed are a core substrate and a manufacturing method thereof. Provided are the core substrate which includes: a core with a first alignment mark and a second alignment mark on one surface thereof; a first insulation layer which is stacked on one surface of the core; a first circuit pattern which is formed on the first insulation layer based on the position of the first alignment mark; a second insulation layer which is stacked on the first insulation layer; and a second circuit pattern which is formed on the second insulation layer based on the position of the second alignment mark, and a manufacturing method thereof. [Reference numerals] (S100) Step for preparing a core with a first alignment mark and a second alignment mark on one surface;(S200) Step for stacking a first insulation layer on one surface of the core;(S300) Step for forming a first circuit pattern on the first insulation layer based on the position of the first alignment mark;(S350) Step for forming a first via which is formed on the first insulation layer based on the position of the first alignment mark and is electrically connected to a first circuit pattern;(S400) Step for stacking a second insulation layer on the first insulation layer;(S500) Step for forming a second circuit pattern on the second insulation layer based on the position of the second alignment mark;(S550) Step for forming a second via which is formed on the second insulation layer based on the position of the second alignment mark and is electrically connected to a second circuit pattern |
