发明名称 PHOTOCURABLE DICING DIE BONDING TAPE
摘要 <p>A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.</p>
申请公布号 KR20130119963(A) 申请公布日期 2013.11.01
申请号 KR20137019067 申请日期 2011.12.16
申请人 HENKEL CORPORATION 发明人 LEE, BYOUNG CHUL;CHIANG PAULINE;BECKER KEVIN HARRIS
分类号 C09J175/04;C09J7/02;C09J183/02;H01L21/60 主分类号 C09J175/04
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