CARRIER

摘要

The present invention relates to a carrier, more specifically, the carrier loading a substrate and transmitting the same to a sputtering chamber in a sputtering deposition process. For this, the present invention includes a substrate plate; an upper pin lifting the substrate upwards due to temperature deformation of a memory alloy while attached to the opposite side to a coated side of the substrate by being formed on the upper part of the substrate plate; and a lower pin supporting the substrate by being formed in the lower part of the substrate plate.