| 摘要 |
The present invention provides a laser processing device, which can rapidly detect the processing quality of a substrate. A processing optical system (131) can move relative to a direction of an X-axis horizontal with the upper surface of a support (113) on which the substrate (102) is arranged and in a direction of a Y-axis perpendicular to the X-axis and horizontal with the upper surface of the support (113), and emit laser used for substrate processing. A resistor measurement unit (132) equipped with a probe plate (133) is used for measuring the resistance value of a part to be processed of the substrate (102) generated based on the processing optical system (131), and simultaneously the measurement position (Pb) is photographed through a camera. Additionally, the resistor measurement unit (132) is mounted on the processing optical system (131) in a manner that the processing position of the processing optical system (131) and the photographing range of the camera are arranged side by side in the direction of the Y-axis. The present invention can be applied to a repairing apparatus, for example substrate. |
