发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To form a first transistor which is required to have less leak current and a second transistor which is required to be faster and consume less power, on a same substrate, and to allow these two kinds of transistors to exhibit sufficient performance respectively.SOLUTION: A first transistor TR1 is required to have less leak current. A second transistor TR2 is required to consume less power and operate at a high speed. An upper surface of the portion where a second diffusion layer SD2 is formed in a substrate SUB is lower than an upper surface of the portion where a first diffusion layer SD1 is formed in the substrate SUB. |
申请公布号 |
JP2013225572(A) |
申请公布日期 |
2013.10.31 |
申请号 |
JP20120096641 |
申请日期 |
2012.04.20 |
申请人 |
RENESAS ELECTRONICS CORP |
发明人 |
KURA TOMOJI;HISA MITSUO;SAKAMOTO KEIJI;IWASAKI TAICHI |
分类号 |
H01L21/8234;H01L21/28;H01L21/336;H01L21/8242;H01L21/8244;H01L27/06;H01L27/088;H01L27/10;H01L27/108;H01L27/11;H01L29/417;H01L29/78 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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