发明名称 EASILY ASSEMBLED CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD
摘要 A chip assembly includes a PCB, a connecting pad fixed on the PCB, and a chip. The connecting pad defines a through hole. The chip is received in the through hole and fixed on the PCB by an adhesive distributed in the through hole. A thickness of the adhesive is less than that of the connecting pad.
申请公布号 US2013285243(A1) 申请公布日期 2013.10.31
申请号 US201213559622 申请日期 2012.07.27
申请人 WU KAI-WEN;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 WU KAI-WEN
分类号 H01L23/48;H01L21/50 主分类号 H01L23/48
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