| 摘要 |
<p>The invention provides a method of photoimaging a substrate. The method comprises the steps of: forming a photoresist layer on at least a part of the surface of the substrate;coating the photoresist layer with a non-photopolymerisable, liquid barrier layer;positioning a coversheet on the substrate in contact with the liquid barrier layer; applying radiation through the coversheet and liquid barrier layer to regions of the photoresist layer to cure the material of the photoresist layer in the regions; removing the phototool from the substrate; and washing the surface of the substrate with one or more developer medium. Uncured photoresist and the material of the liquid barrier layer are removed from the substrate in the wash step. The method of the invention may be used, for example, in the production of printed circuit boards.</p> |
