发明名称 |
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE |
摘要 |
The invention provides a resin composition that is excellent in terms of coating workability and can supply reliability, including the soldering reflow resistance, to a semiconductor device when being used as a die attach material or an adhesive for a heat dissipation member. The resin composition of the invention contains a polymer or copolymer of a conjugated diene compound having at least one functional group, a thermosetting resin and a (meth)acryl polymer or copolymer having a reactive functional group that can react with other reactive groups.
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申请公布号 |
US2013289166(A1) |
申请公布日期 |
2013.10.31 |
申请号 |
US201213976546 |
申请日期 |
2012.01.31 |
申请人 |
MAKIHARA KOUJI;MURAYAMA RYUICHI;SUMITOMO BAKELITE CO., LTD. |
发明人 |
MAKIHARA KOUJI;MURAYAMA RYUICHI |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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