发明名称 SYSTEM ARCHITECTURE FOR VACUUM PROCESSING
摘要 A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.
申请公布号 WO2013163622(A1) 申请公布日期 2013.10.31
申请号 WO2013US38530 申请日期 2013.04.26
申请人 INTEVAC, INC.;BLUCK, TERRY;SHAH, VINAY;RIPOSAN, ALEX 发明人 BLUCK, TERRY;SHAH, VINAY;RIPOSAN, ALEX
分类号 B05D3/00 主分类号 B05D3/00
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