| 摘要 |
<p>The invention relates to a carrier plate on which a plurality of chip components are to be fixed so as to form external electrodes on the outer surfaces of chip components, comprising: a first metal plate having a plurality of first holes penetrating therethrough; a second metal plate having a plurality of second holes penetrating therethrough which correspond to the first holes; and a rubber plate interposed between the first metal plate and the second metal plate, the rubber plate being inserted into the first and second holes, respectively, so as to form support holes inside the first and second holes, the inner diameters of the support holes being smaller than the inner diameters of the first and second holes and enabling the outer and inner surfaces of the chip components to contact and be fixed in the support holes.</p> |
