| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves long life and improves the productivity, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device includes: a housing 10 that has an internal space 11 opening at one side, an inner wall part 13 having an inner peripheral surface 14 defining the internal space 11, and is made of a thermoplastic resin; and a core part 20 engaging with the internal space 11 of the housing 10. The core part 20 includes: a substrate 21; a semiconductor element 22 mounted on the substrate 21; a wire 23 electrically connecting the substrate 21 with the semiconductor element 22; and a mold resin 24 sealing the substrate 21, the semiconductor element 22, and the wire 23. A side surface of the core part 20 has a protruding part 25, and the protruding part 25 contacts with the inner peripheral surface 14 of the inner wall part 13. |
