| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser module which is lightweight, achieves low costs, and where multiple terminals are led out from the interior.SOLUTION: A solder fixing part 11 is formed on an inner surface of a hole 27 and at a peripheral part of the hole 27. As previously described, a resin exposed part 15 is formed on both surfaces of a case part 3 at an outer periphery of the solder fixing part 11. Thus, the solder fixing part 11 is insulated from metal plating 4 by the resin exposed part 15. A terminal 9 is inserted into the hole 27. The terminal 9 is fixed to the solder fixing part 11 by solder 13. After the terminal 9 is fixed, a coating film 29 is provided so as to cover the resin exposed part 15 and the solder 13. The coating film 29 may protrude from the resin exposed part 15 as long as the coating film 29 covers at least the resin exposed part 15. |
