| 摘要 |
A member 10 for a semiconductor manufacturing apparatus includes an electrostatic chuck 20, a cooling unit 40, a spacer (an O-ring 44, an outer periphery spacer 58, or the like) for securing a gap 48 placed between the electrostatic chuck 20 and the cooling unit 40, and a clamp ring 50 placed on the upper surface of the outer periphery of the electrostatic chuck 20. The clamp ring 50 is fastened to the cooling unit 40 with screws 60. The screws 60 are inserted into coil springs 66 that prevent loosening, and are fastened to nuts 68. The coil springs 66 are attached not to the clamp ring side but to the cooling unit side.
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