发明名称 |
COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT |
摘要 |
An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
|
申请公布号 |
US2013284501(A1) |
申请公布日期 |
2013.10.31 |
申请号 |
US201313870414 |
申请日期 |
2013.04.25 |
申请人 |
KEMET ELECTRONICS CORPORATION |
发明人 |
MCCONNELL JOHN E.;WEBSTER ALAN P.;BULTITUDE JOHN;GURAV ABHIJIT |
分类号 |
H05K1/02;H05K3/30 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|