LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHODS OF LEAD FRAME AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame and a semiconductor package which improve the connection reliability achieved when being mounted on a substrate, and to provide manufacturing methods of the lead frame and the semiconductor package.SOLUTION: A semiconductor package includes: a lead frame including a chip mounting part where a semiconductor chip is mounted and a terminal part serving as an external connection terminal; the semiconductor chip mounted on the chip mounting part and electrically connected with the terminal part; a penetration groove penetrating through the terminal part from one surface forming a semiconductor chip side surface to the other surface in a thickness direction; a lid part closing an end part of the penetration groove on the one surface side of the terminal part; and a resin part sealing the semiconductor chip so as to expose the other surface of the terminal part and an inner surface of the penetration groove. The other surface of the terminal part and the inner surface of the penetration groove are coated by a plating film.