| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting method, enabling mounting electronic components with a normal posture in cavities, if a substrate is deformed.SOLUTION: By the recognition of a plurality of reference marks 2m disposed on a substrate 2, each position of the reference marks 2m is calculated. An adhesive B is coated at the center position of each cavity which is detected based on the relative positional relationship between the calculated positions of the plurality of reference marks 2m and the center position of each cavity 3. An image is acquired by imaging each cavity 3 having the coated adhesive B. An electronic component 4 is mounted at the center position of the adhesive B in each cavity 3 obtained based on the image. |
