发明名称 |
Power Module with Directly Attached Thermally Conductive Structures |
摘要 |
A power module includes a substrate having an electrically insulative member with opposing first and second metallized sides and one or more semiconductor die attached to the first metallized side of the substrate. A plurality of thermally conductive structures are laterally spaced apart from one another and individually attached directly to the second metallized side of the substrate so that the plurality of thermally conductive structures extend outward from the second metallized side.
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申请公布号 |
US2013285234(A1) |
申请公布日期 |
2013.10.31 |
申请号 |
US201213459844 |
申请日期 |
2012.04.30 |
申请人 |
UHLEMANN ANDRE;HERBRANDT ALEXANDER;BROERMANN FRANK;INFINEON TECHNOLOGIES AG |
发明人 |
UHLEMANN ANDRE;HERBRANDT ALEXANDER;BROERMANN FRANK |
分类号 |
H01L23/367 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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