发明名称 HEAD ASSEMBLY OF CHIPMOUNTER
摘要 PURPOSE: A head assembly of a chip mounter is provided to lighten the weight of a chip mounter head by implementing vertical driving of a plurality of spindles with a single or minimum number of actuators. CONSTITUTION: A plurality of selectors (120) is installed on the upper part of a plate (110). The plurality of selectors includes an inner bump protruded to the inner side. The plurality of spindles is located in the lower part of the plate in correspondence to the plurality of selectors respectively. The plurality of spindles includes an outer bump (131) going in gear with the inner bump of the selector. A vertical driving module (140) drives the plate up and down. A rotary motor (150) rotates the plurality of selectors installed on the upper part of the plate.
申请公布号 KR20130119216(A) 申请公布日期 2013.10.31
申请号 KR20120042199 申请日期 2012.04.23
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 HONG, SUNG RYONG
分类号 H05K13/04;H01L21/60 主分类号 H05K13/04
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