SOLID-STATE IMAGE PICK-UP DEVICE

摘要

A solid-state image pick-up device (11) is provided with an image pick-up region (12) in which a plurality of image elements (14) are arranged in parallel on a semiconductor substrate (22), and a peripheral circuit region (13). The image elements (14) are provided with the following: a light receiving section (21) formed in the semiconductor substrate (22); a wiring layer (23) formed on the semiconductor substrate (22); and a light collecting element (25) formed on the wiring layer (23). The light collecting element (25) comprises a plurality of circular arc-shaped light transmitting films (26) having as the center thereof an axis perpendicular to the semiconductor substrate (22) and that are divided at the same degree as the wavelength of incident light or at a line width shorter than such degree. In the picture elements (14) positioned in a peripheral section (16) in an image pick-up region (12), from among the plurality of light transmitting films (26) constituting the light collecting element (25), the average height of light transmitting films (26) positioned more toward the central section (15) of the image pick-up region (12) than the axis thereof is higher than the average height of light transmitting films (26) positioned more toward the peripheral section (16) of the image pick-up region (12) than the axis thereof.