发明名称 |
SUBSTRATE PROCESSING DEVICE, MAINTENANCE METHOD AND PROGRAM |
摘要 |
PROBLEM TO BE SOLVED: To enable resetting an accumulated film thickness value of each dummy substrate when a dummy carrier is re-input.SOLUTION: A substrate processing device at least comprises: a processing chamber for processing a variety of predetermined number of substrates; a substrate housing unit having a mounted dummy carrier in which a dummy substrate, one type of the variety of substrates, is housed; a storage unit for retaining the film thickness value of each dummy substrate in the dummy carrier, when the dummy carrier is conveyed from the substrate housing unit; and when the dummy carrier is re-input to the substrate housing unit, a management unit for resetting the film thickness of each dummy substrate in the dummy carrier, on the basis of the film thickness value retained in the storage unit. |
申请公布号 |
JP2013225659(A) |
申请公布日期 |
2013.10.31 |
申请号 |
JP20130029656 |
申请日期 |
2013.02.19 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
YONEDA AKIHIKO;KOTANI HIROSHI;MIZUGUCHI YASUHIRO |
分类号 |
H01L21/02;H01L21/205;H01L21/3065;H01L21/31;H01L21/677 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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