发明名称 SUBSTRATE PROCESSING DEVICE, MAINTENANCE METHOD AND PROGRAM
摘要 PROBLEM TO BE SOLVED: To enable resetting an accumulated film thickness value of each dummy substrate when a dummy carrier is re-input.SOLUTION: A substrate processing device at least comprises: a processing chamber for processing a variety of predetermined number of substrates; a substrate housing unit having a mounted dummy carrier in which a dummy substrate, one type of the variety of substrates, is housed; a storage unit for retaining the film thickness value of each dummy substrate in the dummy carrier, when the dummy carrier is conveyed from the substrate housing unit; and when the dummy carrier is re-input to the substrate housing unit, a management unit for resetting the film thickness of each dummy substrate in the dummy carrier, on the basis of the film thickness value retained in the storage unit.
申请公布号 JP2013225659(A) 申请公布日期 2013.10.31
申请号 JP20130029656 申请日期 2013.02.19
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 YONEDA AKIHIKO;KOTANI HIROSHI;MIZUGUCHI YASUHIRO
分类号 H01L21/02;H01L21/205;H01L21/3065;H01L21/31;H01L21/677 主分类号 H01L21/02
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