发明名称 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND CURED MATERIAL OF THE SAME, AND PRINTED WIRING BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an alkali-developable photosensitive resin composition that is environmentally friendly, and a dry film and a cured material of the composition, and a printed wiring board having a cured coating of the composition.SOLUTION: The photosensitive resin composition comprises (A) a resin using a recovered polyester as a raw material, (B) a photopolymerization initiator and (C) a carboxyl group-containing photosensitive resin except for the resin (A). The resin (A) includes at least one resin selected from the following (A1), (A2) and (A3). They are: (A1) a carboxyl group-containing resin obtained by depolymerizing (a) a recovered polyester with (b) a polyol and further reacting (c) a polybasic acid or its anhydride; (A2) a (meth)acrylate photosensitive resin obtained by depolymerizing the (a) recovered polyester with the (b) polyol and then reacting a compound (d) having an ethylenically unsaturated group and a functional group that can react with an acid such as a (meth)acrylic acid or its derivative or with an alcohol; and (A3) a carboxyl group-containing resin obtained by depolymerizing the (a) recovered polyester with the (b) polyol, reacting a compound (d) having an ethylenically unsaturated group and a functional group that can react with an acid such as a (meth)acrylic acid or its derivative or with an alcohol to obtain a (meth)acrylate photosensitive resin, and further reacting the obtained resin with the (c) polybasic acid or its anhydride.
申请公布号 JP2013225151(A) 申请公布日期 2013.10.31
申请号 JP20130144000 申请日期 2013.07.09
申请人 TAIYO HOLDINGS CO LTD 发明人 OKAMOTO DAICHI;ARIMA MASAO
分类号 G03F7/027;C08G63/91;C09D7/12;C09D167/00;C09D167/07;C09D201/00;C09D201/08;G03F7/004;H05K3/28 主分类号 G03F7/027
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