DEFECT CLASSIFICATION USING CAD-BASED CONTEXT ATTRIBUTE

摘要

PROBLEM TO BE SOLVED: To provide an improved method, system and software for automatic defect classification based on inspection data.SOLUTION: A method for classification includes a step for receiving an image of an area including an image location to be an object of a semiconductor wafer on which a pattern has been formed, and a step for receiving computer-aided design (CAD) data relating to the pattern, corresponding to the image location and including a CAD location to be an object. At least one value for one or more attributes of the image location to be the object is calculated based on a context of the CAD location to be the object with respect to the CAD data.