| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a sapphire substrate capable of adjusting the amount of warpage by warping a substrate to a predetermined surface in the substrate having a large diameter of 4 inches or more, and also to provide the sapphire substrate.SOLUTION: A method for manufacturing a sapphire substrate in which a substrate 10 obtained by slicing a sapphire ingot and having warpage is subjected to processing including a plurality of steps to manufacture a sapphire substrate includes: a grinding step of grinding both surfaces of the substrate 10; a wet blasting step of performing wet blasting process on one or both of surfaces of the substrate 10 after the grinding step: a sticking step of sticking the substrate 10 to a substrate holding member 300 to hold the substrate 10 after the wet blasting step; a lapping step of performing lapping process on a recessed surface of the substrate 10 after the sticking step; and a grinding step of performing CMP grinding on the lapping-processed surface of the substrate 10 after the lapping step. |
