发明名称 COMPACT TID HARDENING NMOS DEVICE AND FABRICATION PROCESS
摘要 A radiation-hardened transistor is formed in a p-type semiconductor body having an active region doped to a first level and surrounded by a dielectric filled shallow trench isolation region. N-type source/drain regions are disposed in the active region and spaced apart to define a channel. A gate is disposed above the channel, and is self-aligned with the source/drain regions. First and second p-type regions are disposed in the p-type semiconductor body on either side of one of the source/drain regions and are doped to a second level higher than the first doping level. The first and second p-type regions are self aligned with and extend outwardly from a first side edge of the gate. The ends of the gate extend past the first and second p-type regions.
申请公布号 US2013285147(A1) 申请公布日期 2013.10.31
申请号 US201313870860 申请日期 2013.04.25
申请人 DHAOUI FETHI 发明人 DHAOUI FETHI
分类号 H01L29/78;H01L29/66 主分类号 H01L29/78
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