| 摘要 |
In at least one embodiment, a sensing apparatus is provided. The sensing apparatus comprises a substrate, a thermopile, and a readout circuit. The thermopile includes an absorber positioned above the substrate for receiving thermal energy and for generating an electrical output indicative of the thermal energy. The readout circuit is positioned below the absorber and includes at least one first switch positioned therein for being electrically coupled to the thermopile to provide a bypass in the event the thermopile is damaged.
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